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LHR21E - Random Orbital Polisher

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TIME SAVING UP TO 40%.
40% ENERGY SAVING.
NO HOLOGRAMS.
EASY TO USE.
SUPERIOR FINISH.
MAXIMUM CONTROL.
NO SURFACE OVERHEATING.
LARGER CONTACT AREA.
2.-lhr21e
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2.-lhr21e-2
2.-lhr21e-3
Manufacturer: RUPES

Random Orbital Polisher RUPES

 

Random Orbital Polisher RUPES

 

Features

  

TIME SAVING UP TO 40%

The new Big Foot polisher is an amazing tool that enables you to obtain excellent results in no time. LESS steps, LESS time, LESS compound
consumption and GREATER profits.

 

40% ENERGY SAVING

Thanks to their design and technology, the new random orbital polishers by RUPES are more energy efficient as compared to traditional polishers.

 

NO HOLOGRAMS

Holograms are micro scratches made by traditional polishers: the new random orbital polishers don't leave holograms and enable excellent results in a single step.

 

EASY TO USE

Polishing has always been considered an operation that requires experience and skill. Inexperience may in fact result in surfaces being damaged and in the exposure of edges and sharp corners. RUPES has eliminated these risks with its new random orbital polisher that enables even less experienced operators to achieve professional results.

 

SUPERIOR FINISH

The goal of operators has always been achieving two results: gloss and colour depth. In designing its polishers, RUPES has taken these requirements into account to allow operators to achieve unique andextraordinary results.

 

MAXIMUM CONTROL

RUPES polishers stand out because of their accuracy and easiness of use, which enable to obtain high quality results with less fatigue.

 

NO SURFACE OVERHEATING

Superficial temperature must be kept within specific safety limits. The random orbital movement and technical features of new RUPES polishersmaintain the superficial temperature within acceptable limits end eliminate the risk of “burning” the clearcoat.

 

LARGER CONTACT AREA

The new RUPES random orbital polishers enable to use the whole surface of the buffer. When using traditional rotary polishers , it is necessary to maintain the buffer inclined as compared to the work surface due to the high temperatures that develop on the machined panel, which reduces the useful surface of the buffer to 40 %.

 

 

Features:

  • The 21 mm orbit is suitable for all polishing operations on all types of surfaces: painted surfaces or recently painted surfaces and finishing applications.
  • Denibbing.
  • Holograms removing.

 

Technical Data

 

Speed control

Weight

2,600 Kg

R.P.M.

2000 – 4200

Power

500 W/hp

Ø orbit

21 mm

Ø max polishing pad

180 mm

Ø backing pad

150 mm

 

Video

 


         

                                                    


 

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